Document sans titre

IEEE DTIS Conference Chairs

   Dr. Mohamed Masmoudi
   ENIS - Tunisia

   Dr. Michel Renovell
   LIRMM - France

Committees

Sponsors & Partners

News

The submission of paper has been closed

27 February 2012 Notification of acceptance

26 March 2012 Final version due date


GENERAL SCOPE

Integrated System Design :
SOC, SIP design
Multiprocessor systems
Embedded systems
Wireless systems
Network on Chip
Analog, Mixed Signal and RF systems
Digital Design Automation Technics
MEMS and MOEMS systems
Low Voltage and Low Power systems
Innovative technologies
Synthesis (physical, logic,...) 
Simulation, Validation and Verification
3D-Design

Integrated System Technology : 
Nanoelectronics 
Device modeling 
Material characterization 
Failure analysis 
New components 
Packaging 
Process technology 
Reliability issues
3D stacked IC Technology

Integrated System Testing : 
Defect and fault modelling 
Analog and Mixed Signal testing 
MEMS/MOEMS testing
SOC and SIP testing 
Delay testing 
Memory testing 
Fault Simulation, ATPG 
DFT, BIST and BISR 
On-line testing and fault tolerant systems 
ATE issues 
Alternative test strategies 
3D-test